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生產(chǎn)能力：800/1200 kg/h 電機(jī)功率：1.5 kW 切菜規(guī)格：800/1200 kg/h 尺寸：1300×600×1050 mm/1800×710×103
對主軸和刀環(huán)進(jìn)行維修和調(diào)整時，切片機(jī)如果在切片后期的出現(xiàn)晶片崩邊現(xiàn)象，這種情況很有可能是由于圓形刀片的因素引起的，通過上面的分析我們可知在切片時因為圓形刀片刀片的振動和內(nèi)在摩擦力的存在從而引起晶片的振動，導(dǎo)致崩邊現(xiàn)象的產(chǎn)生。這時可以采用重新張刀的方法，調(diào)整刀片刃口的同軸度，或者采用修刀的方法進(jìn)而排除晶片崩邊現(xiàn)象的發(fā)生。
During the maintenance and adjustment of the spindle and knife ring, if the chip edge collapse occurs in the later stage of slicing, it is likely to be caused by the factors of the circular blade. Through the above analysis, we can see that the vibration of the chip and the edge collapse are caused by the vibration of the circular blade and the existence of internal friction during slicing. At this time, the method of re tensioning the knife can be used to adjust the coaxiality of the blade edge, or the method of trimming the knife can be used to eliminate the occurrence of wafer edge collapse.
飛片現(xiàn)象就是指在晶片切割過程中，會泛起飛片的現(xiàn)象。這種現(xiàn)象在切薄片和晶片切割結(jié)束到石墨托板處時特別容易發(fā)生。這是因為刀片對晶片的摩擦力過大而使石墨托板承受不了，造成品片被刀片帶走的現(xiàn)象。
Flyer phenomenon refers to the phenomenon that wafers will take off in the process of wafer cutting. This phenomenon is particularly easy to occur when the sheet and wafer are cut to the graphite support plate. This is because the friction between the blade and the wafer is too large for the graphite support plate to bear, resulting in the phenomenon that the wafer is taken away by the blade.
從上面的分析可知，分條機(jī)刀片的刀片與晶片之間有切削液，刀片對晶片有摩擦力的作用，摩擦力的大小與切割面積和切削液流量成正比，所以采用減小切削液流量的辦法可以有用飛片現(xiàn)象。
From the above analysis, it can be seen that there is cutting fluid between the blade and the wafer of the slitter blade, and the blade has the effect of friction on the wafer. The magnitude of friction is directly proportional to the cutting area and the cutting fluid flow. Therefore, the method of reducing the cutting fluid flow can effectively solve the flyer phenomenon.
從實際操縱中我們發(fā)現(xiàn)，當(dāng)切割晶片的出刀口處有切削液滴下時，也會很輕易泛起飛片的現(xiàn)象，這是因為切削液流量過大，而使摩擦力增大，造成飛片的現(xiàn)象。因此，切削液流量不宜過大，能夠知足切割時刃口處的冷卻和潤滑的流量即可。
From the actual operation, we found that when the cutting fluid drops at the cutting edge of the cutting wafer, it will also easily take off the flake. This is because the friction increases due to the excessive flow of cutting fluid, resulting in the phenomenon of flying flake. Therefore, the cutting fluid flow should not be too large, which can meet the cooling and lubrication flow at the cutting edge during cutting.